Infineon and Teradyne join forces to progress power testing technologies
In a groundbreaking development, Teradyne, Inc. and Infineon Technologies AG have announced a strategic partnership aimed at advancing power semiconductor testing for the rapidly expanding Internet of Things (IoT) market. The collaboration, announced in early July 2025, is set to revolutionise the testing of power semiconductors, critical components in energy-efficient IoT devices.
The partnership will see Teradyne, a leading provider of automated test equipment, combine its expertise in innovative, high-volume test solutions with Infineon's advanced power semiconductor technologies. This collaboration is designed to enhance testing capabilities specifically tailored for IoT power devices, addressing the increasing complexity and miniaturisation of power semiconductors used in IoT applications.
The partnership will focus on improving the reliability and efficiency in semiconductor manufacturing by integrating advanced test methodologies suited for wide bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN). These technologies are crucial for power efficiency in IoT devices and applications such as electric vehicles and renewable energy systems.
Rick Burns, the president of the semiconductor test group at Teradyne, expressed his excitement about the strategic partnership with Infineon. Alexander Gorski, the executive vice president of frontend operations at Infineon, also expressed enthusiasm about the collaboration.
Infineon secures continued manufacturing support and enhanced flexibility by entering into a service agreement with Teradyne. The acquisition provides mutual benefits for both companies, allowing Teradyne to accelerate its roadmap in the power semiconductor segment.
The partnership will extend Teradyne's leadership in the power semiconductor market by integrating Infineon's experienced workforce with its Power Semiconductor business unit. Teradyne plans to build upon these capabilities as it collaborates on new solutions with a key market leader, Infineon Technologies AG.
The collaboration is designed to offer the scale and flexibility needed by Infineon's markets and customers. It is expected to help Infineon in addressing the test challenges in new technologies like silicon carbide and gallium nitride. Infineon's technology will enhance Teradyne's market-leading ETS product portfolio.
The partnership provides Infineon employees with a long-term perspective in a highly specialized company. Teradyne is fully committed to the 80-person team at Infineon's Regensburg site. The integration of Infineon's experienced workforce with Teradyne is expected to accelerate innovation.
In summary, the partnership between Teradyne and Infineon is intended to deliver cutting-edge, scalable power semiconductor test solutions customised for the evolving demands of the IoT market, leveraging their combined strengths in semiconductor technology and automated test innovation. This collaboration reflects a broader industry trend where semiconductor manufacturers and test solution providers cooperate closely to accelerate the deployment of high-performance, reliable power devices in emerging markets like IoT, electric vehicles, and renewable energy.
- This strategic partnership between Teradyne, a leading test equipment provider, and Infineon Technologies, an advanced power semiconductor technology company, is aimed at enhancing testing capabilities specifically for Internet of Things (IoT) power devices.
- The collaboration seeks to integrate advanced test methodologies for wide bandgap (WBG) semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), to address the increasing complexity and miniaturization of power semiconductors used in IoT applications, and improve the reliability and efficiency in semiconductor manufacturing.
