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Upgraded DualPack 3 IGBT7 Modules Boast High Power Concentration and Facilitate Smooth System Assembly

New high-power modules equipped with IGBT7 technology launched by Microchip Technology in six diverse options at 1200V and 1700V, boasting current capacity ranging from 300 to 900 Amperes as part of their DualPack 3 (DP3) product line.

Upgraded Dual IGBT7 Modules, the DualPack 3, Offer Increased Power Concentration and Streamlined...
Upgraded Dual IGBT7 Modules, the DualPack 3, Offer Increased Power Concentration and Streamlined System Assembly

Upgraded DualPack 3 IGBT7 Modules Boast High Power Concentration and Facilitate Smooth System Assembly

Microchip Technology has made an exciting announcement, unveiling a new family of DualPack 3 (DP3) power cast modules. This innovative product line is designed to address the growing demand for compact, cost-effective, and simplified power converter solutions.

The DP3 power cast modules feature advanced IGBT7 technology, which sets them apart in the market. This technology not only enhances protection and control during high-voltage switching but also reduces power cast losses by up to 15-20% compared to IGBT4 devices.

One of the standout features of the DP3 power cast modules is their high-current capacity, ranging from 300-900A. These modules operate reliably at higher temperatures, up to 175°C during overload, making them ideal for a wide range of applications.

The DP3 power cast modules eliminate the need for paralleling multiple modules, thereby simplifying system design. They also offer a compact footprint of approximately 152 mm × 62 mm × 20 mm, making them a space-saving solution for industrial drives, renewables, traction, energy storage, agricultural vehicles, and general-purpose motor drive applications.

Leon Gross, Corporate Vice President of Microchip's High-Reliability and RF Business Unit, commented on the launch of the new DualPack 3 power cast modules. He highlighted their ability to address common challenges such as dv/dt, complexity in driving, higher conduction losses, and no overload capability.

Moreover, the DP3 power cast modules enable a frame size jump for increased power output and help reduce system complexity and Bill of Materials (BOM) costs. They are available in six variants at 1200V and 1700V and can be integrated as part of a comprehensive system solution alongside Microchip's other components.

In addition, the DP3 modules provide a second-source option to industry-standard EconoDUAL packages. They can be used in a phase-leg configuration, further enhancing their versatility.

In conclusion, the new DualPack 3 power cast modules from Microchip Technology are a significant step forward in power management solutions. Their compact size, high current capacity, and advanced IGBT7 technology make them an attractive choice for a variety of industries.

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